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Dr. Fred Lee and other guests attended the third Power Electronics Innovation Collaboration Forum in HUST

Author:    Release time: Nov 21, 2019    click:

On November 9, 2019, the third Power Electronics Innovation Collaborative Forum of Huazhong University of Science and Technology was held in the Electrical Building with the theme of "High Power Density Packaging Integration Technology". The representatives of the electrical industry who participated in the event gathered together to exchange and discuss the innovation and development of the power electronics industry.


On the morning of the 9th, the opening ceremony was presided over by Professor Kang Yong and Professor Jiang Dong from the School of Electrical Engineering. Chen Jin, Party Secretary of the School of Electricaland ElectronicsEngineering(SEEE), and Prof. Kang Yong from the Department of Applied ElectronicsEngineering gave an opening speech at the forum.Dr. Fred C. Lee, Academician of the National Academy of Engineeringof USA, foreign academician of Chinese Academy of Engineering and honorary professor of Huazhong University of Science and Technology, gave an academic lecture entitled "Power Electronics Packaging and Integration", and introduced the current situation and development direction of power electronics packaging and integration technology.Qiu Yufeng, Dean of the Global Energy Internet Research Institute, Prof. Sheng Kuang of Zhejiang University, Prof. Yang Xu of Xi'an Jiaotong University and Director Song Gaosheng from Mitsubishi Electric Semiconductor Greater China, respectively made special academic reports.


On the afternoon of the 9th, a discussionsessionwas held between the company and the university. Chen Yulin, deputy general manager of Innoscience, Associate Professor Liang Lin,Professor Peng Han and Professor Wang Zhiqiang conducted academic reportsrespectively.


Since 2017, the Power Electronics Collaborative Innovation Forum of Huazhong University of Science and Technology has been held once a year, and is now the thirdevent.For the first time, this year's forum was held in the form of a special topic, and the theme of "High Power Density Packaging Integration Technology" was selected.This theme is a new hottopicin the field of power electronics, and it is also a direction in the power electronics discipline of Huazhong University of Science and Technology in recent years.